- 附件：attached
- 样品：sample
- 承认：approval
- 答复：answer;reply
- 规格：spec
- 与…同样的：the same as
- 前版本：previous version(old version)
- 生产：production
- 确认：confirm
- 再次确认：double confirm
- 工程问题：engineering query（EQ）
- 尽快：ASAP(as soon as possible)
- 生产文件：production gerber
- 联系某人：contact somebody
- 提交样板：submit sample
- 交货期：delivery date
- 电测成本：ET（electrical test） cost
- 通断测试：Open and short testing
- 参考：refer to
- IPC标准：IPC standard
- IPC二级：IPC class 2
- 可接受的：acceptable
- 允许：permit
- 制造：manufacture
- 修改：revision
- 公差：tolerance
- 忽略：ignore(omit)
- 工具孔：tooling hole
- 安装孔：mounting hole
- 元件孔：component hole
- 槽孔：slot
- 邮票孔：snap off hole
- 导通孔：via
- 盲孔： blind via
- 埋孔：buried via
- 金属化孔：PTH(plating through hole)
- 非金属化孔：NPTH( no plating through hole)
- 孔位：hole location
- 避免：avoid
- 原设计：original design
- 修改：modify
- 按原设计：leave it as it is
- 附边：waste tab
- 铜条：copper strip
- 拼板强度：panel strong
- 板厚：board thickness
- 删除：remove(delete)
- 削铜：shave the copper
- 露铜：copper exposure
- 光标点：fiducial mark
- 不同：be different from(differ from)
- 内弧：inside radius
- 焊环：annular ring
- 单板尺寸：single size
- 拼板尺寸：panel size
- 铣：routing
- 铣刀：router
- V-cut：scoring
- 哑光：matt
- 光亮的：glossy
- 锡珠：solder ball(solder plugs)
- 阻焊：solder mask(solder resist)
- 阻焊开窗：solder mask opening
- 单面开窗：single side mask opening
- 补油：touch up solder mask
- 补线：track welds
- 毛刺：burrs
- 去毛刺：deburr
- 镀层厚度：plating thickness
- 清洁度：cleanliness
- 离子污染：ionic contamination
- 阻燃性：flammability retardant
- 黑化：black oxidation
- 棕化：brown oxidation
- 红化：red oxidation
- 可焊性：solderability
- 焊料：solder
- 包装：packaging
- 角标：corner mark
- 特性阻抗：characteristic impedance
- 正像：positive
- 负片：negative
- 镜像：mirror
- 线宽：conductor width
- 线距：conductor spacing
- 做样：build sample
- 按照：as per
- 成品：finished
- 做变更：make the change
- 相类似：similar to
- 规格：specification
- 下移：shift down
- 垂直地：vertically
- 水平的：horizontally
- 增大：increase
- 缩小：decrease
- 表面处理：Surface Finishing
- 波峰焊：wave solder
- 钻孔数据：drilling date
- 标记：Logo
- Ul 标记：Ul Marking
- 蚀刻标记：etched marking
- 周期：date code
- 翘曲：bow and twist
- 外层：outer layer
- 内层：internal layer
- 顶层：top layer
- 底层：bottom layer
- 元件面：component side
- 焊接面：solder side
- 阻焊层：solder mask layer
- 丝印层：legend layer (silkscreen layer or over layer)
- 兰胶层：peelable SM layer
- 贴片层：paste mask layer
- 碳油层：carbon layer
- 外形层：outline layer(profile layer)
- 白油：white ink
- 绿油：green ink
- 喷锡：hot air leveling (HAL)
- 水金：flash gold
- 插头镀金：plated gold edge-board contacts
- 金手指：Gold-finger
- 防氧化：Entek(OSP)
- 沉金：Immersion gold (chem. Gold)
- 沉锡：Immersion Tin(chem.Tin)
- 沉银：Immersion Silver (chem. silver)
- 单面板：single sided board
- 双面板：double sided board
- 多层板：multilayer board
- 刚性板：rigid board
- 挠性板：flexible board
- 刚挠板：flex-rigid board
- 铣：CNC (mill , routing)
- 冲：punching
- 倒角：beveling
- 倒斜角：chamfer
- 倒圆角：fillet
- 尺寸：dimension
- 材料：material
- 介电常数：Dielectric constant
- 菲林：film
- 成像：Imaging
- 板镀：Panel Plating
- 图镀：Pattern Plating
- 后清洗：Final Cleaning
- 叠层：layup (stack-up)
- 污染焊盘：contaminate pad
- 分孔图：drill chart
- 度数：degree
- 被…覆盖：be covered with
- 负公差：minus tolerance
- 标靶盘： target pad
- 外形公差：routing tolerance
- 芯板：core
