PCB工程中英文单词

  • 附件:attached
  • 样品:sample
  • 承认:approval
  • 答复:answer;reply
  • 规格:spec
  • 与…同样的:the same as
  • 前版本:previous version(old version)
  • 生产:production
  • 确认:confirm
  • 再次确认:double confirm
  • 工程问题:engineering query(EQ)
  • 尽快:ASAP(as soon as possible)
  • 生产文件:production gerber
  • 联系某人:contact somebody
  • 提交样板:submit sample
  • 交货期:delivery date
  • 电测成本:ET(electrical test) cost
  • 通断测试:Open and short testing
  • 参考:refer to
  • IPC标准:IPC standard
  • IPC二级:IPC class 2
  • 可接受的:acceptable
  • 允许:permit
  • 制造:manufacture
  • 修改:revision
  • 公差:tolerance
  • 忽略:ignore(omit)
  • 工具孔:tooling hole
  • 安装孔:mounting hole
  • 元件孔:component hole
  • 槽孔:slot
  • 邮票孔:snap off hole
  • 导通孔:via
  • 盲孔: blind via
  • 埋孔:buried via
  • 金属化孔:PTH(plating through hole)
  • 非金属化孔:NPTH( no plating through hole)
  • 孔位:hole location
  • 避免:avoid
  • 原设计:original design
  • 修改:modify
  • 按原设计:leave it as it is
  • 附边:waste tab
  • 铜条:copper strip
  • 拼板强度:panel strong
  • 板厚:board thickness
  • 删除:remove(delete)
  • 削铜:shave the copper
  • 露铜:copper exposure
  • 光标点:fiducial mark
  • 不同:be different from(differ from)
  • 内弧:inside radius
  • 焊环:annular ring
  • 单板尺寸:single size
  • 拼板尺寸:panel size
  • 铣:routing
  • 铣刀:router
  • V-cut:scoring
  • 哑光:matt
  • 光亮的:glossy
  • 锡珠:solder ball(solder plugs)
  • 阻焊:solder mask(solder resist)
  • 阻焊开窗:solder mask opening
  • 单面开窗:single side mask opening
  • 补油:touch up solder mask
  • 补线:track welds
  • 毛刺:burrs
  • 去毛刺:deburr
  • 镀层厚度:plating thickness
  • 清洁度:cleanliness
  • 离子污染:ionic contamination
  • 阻燃性:flammability retardant
  • 黑化:black oxidation
  • 棕化:brown oxidation
  • 红化:red oxidation
  • 可焊性:solderability
  • 焊料:solder
  • 包装:packaging
  • 角标:corner mark
  • 特性阻抗:characteristic impedance
  • 正像:positive
  • 负片:negative
  • 镜像:mirror
  • 线宽:conductor width
  • 线距:conductor spacing
  • 做样:build sample
  • 按照:as per
  • 成品:finished
  • 做变更:make the change
  • 相类似:similar to
  • 规格:specification
  • 下移:shift down
  • 垂直地:vertically
  • 水平的:horizontally
  • 增大:increase
  • 缩小:decrease
  • 表面处理:Surface Finishing
  • 波峰焊:wave solder
  • 钻孔数据:drilling date
  • 标记:Logo
  • Ul 标记:Ul Marking
  • 蚀刻标记:etched marking
  • 周期:date code
  • 翘曲:bow and twist
  • 外层:outer layer
  • 内层:internal layer
  • 顶层:top layer
  • 底层:bottom layer
  • 元件面:component side
  • 焊接面:solder side
  • 阻焊层:solder mask layer
  • 丝印层:legend layer (silkscreen layer or over layer)
  • 兰胶层:peelable SM layer
  • 贴片层:paste mask layer
  • 碳油层:carbon layer
  • 外形层:outline layer(profile layer)
  • 白油:white ink
  • 绿油:green ink
  • 喷锡:hot air leveling  (HAL)
  • 水金:flash gold
  • 插头镀金:plated gold edge-board contacts
  • 金手指:Gold-finger
  • 防氧化:Entek(OSP)
  • 沉金:Immersion gold (chem. Gold)
  • 沉锡:Immersion Tin(chem.Tin)
  • 沉银:Immersion Silver (chem. silver)
  • 单面板:single sided board
  • 双面板:double sided board
  • 多层板:multilayer board
  • 刚性板:rigid board
  • 挠性板:flexible board
  • 刚挠板:flex-rigid board
  • 铣:CNC (mill , routing)
  • 冲:punching
  • 倒角:beveling
  • 倒斜角:chamfer
  • 倒圆角:fillet
  • 尺寸:dimension
  • 材料:material
  • 介电常数:Dielectric constant
  • 菲林:film
  • 成像:Imaging
  • 板镀:Panel Plating
  • 图镀:Pattern Plating
  • 后清洗:Final Cleaning
  • 叠层:layup (stack-up)
  • 污染焊盘:contaminate pad
  • 分孔图:drill chart
  • 度数:degree
  • 被…覆盖:be covered with
  • 负公差:minus tolerance
  • 标靶盘: target pad
  • 外形公差:routing tolerance
  • 芯板:core
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